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- Read, listen, and view to lectures as they are posted throughout the week.
- Review and complete weekly Participation Post assignment.
- Browse through the EServer Technical Communication Library and the STC TCBOK, both of which we looked at during Week 1, and pick a couple of subjects you might want to explore for your Technical Communication Report project. One Initiating post should discuss why these topics are of interest to you.
- Select a tool use commonly use for academic or professional purposes and answer question 7 on p. 162 of Solving Problems in Technical Communication, or identify a work context (which can include your role as student) and sketch out both a CEM showing the different texts that you receive, produce, alter, and hand off, and sketch out a GEM showing the different texts that support the task you’re examining. For one initiating post, discuss the process of creating the CEM and GEM and any observations, insights, questions, or ideas emerged as you analyzed your work context.
- The Responding post should respond to one of your classmates’ posts.
- Post the Week 6 Reflection assignment. Due: Tuesday, Feb. 23, 10:00 PM.
- Complete the Documentation Project #1 assignment. Peer-review draft due: Feb. 29, 10:00 PM.
- Continue working on the Technical Communication Report Proposal: Due: March 11, 10:00 PM.
- Begin work on the Week 7 Reflection assignment. Due: Tuesday, March 1, 10:00 PM.
- Preview and begin work on the Documentation Project #2. Peer-review draft due: March 28, 10:00 PM.
- Johnson-Sheehan, Richard. Technical Communication Strategies for Today. 2nd ed. Boston: Pearson, 2015. (Required textbook)
- Ch. 12: “Researching and Research Methods,” pp. 342-366.
- Johnson-Eilola, Johndan, and Stuart A. Selber. Solving Problems in Technical Communication. Chicago: U of Chicago P, 2013. (Required textbook)
- Swarts, Jason. Ch. 6: “How Can Work Tools Shape and Organize Technical Communication?”, pp. 146-164.
- Spinuzzi, Clay. Ch. 11: “How Can Technical Communicators Study Work Contexts?”, pp. 262-284.